It was the solder, partially, inadequate cooling system design was the rest of the equation. the solder is tin based instead of lead, thanks EPA, so the tin is more brittle. Add to that the engineers designed a mediocre cooling system usually with one cooling tube for the CPU , GPU and chipset. This causes the GPU to overheat in demanding scenarios like gaming when all the chips are roasting. When it overheats it flexes due to expansion and cracks the BGA solder joints. Usually the heat fix might bring it back for awhile but the problem will return unless you have some method of cooling the chips better, like a fan utility to run the fans at 100%. HP had a big problem with this in the DV6000-DV9000's and the TX2's. Dell had it in almost any laptop that ran an 8400-8800GT. I have a 1705 with the 8800 that I baked and it works but I have a utility to keep the fans at max all the time. If I use it on the battery I also use the Nvidia utility to downclock the GPU as low as it will go.